TXRF 310Fab-R

Advanced tool for ultratrace elemental contamination analysis

  • Detects ultra-trace elemental contamination
  • Fully automated and fab-compatible
  • Supports process control in semiconductor manufacturing
  • Non-destructive surface analysis

The TXRF 310Fab-R offers highly sensitive detection of surface contamination using total reflection X-ray fluorescence (TXRF). Designed for both research and high-volume semiconductor environments, it delivers accurate, repeatable measurements for process monitoring and defect reduction.

With full SECS/GEM integration and a 3-beam optical configuration, the system ensures efficient throughput and is compliant with global safety and environmental standards. It supports spatial mapping and automated diagnostics, enabling continuous yield improvement.

TXRF 310Fab-R

TXRF 310Fab-R Overview

The TXRF 310Fab-R is an advanced metrology tool designed for ultra-trace elemental contamination analysis on semiconductor materials. It offers non-destructive analysis while maintaining sample integrity, making it ideal for laboratory research and high-throughput semiconductor fabrication. This tool provides precise contamination diagnostics to improve process monitoring and yield optimization and is engineered to meet international regulatory standards for safe global deployment.

TXRF 310Fab-R Features

Detects elemental contamination from Na to U
Ultratrace sensitivity (e.g., Ni <1E9 atoms/cm²)
Configurable mapping up to 5×5 with 30 mm pitch
Automated sample alignment and data capture
Electronically cooled detectors
SECS/GEM-compliant for fab integration

TXRF 310Fab-R Specifications

Technique Total reflection X-ray fluorescence (TXRF)
Sensitivity Al <2.5E11 atoms/cm², Ni <1E9 atoms/cm²
Sample compatibility Wafers, photomasks
Measurement items Surface elemental contamination
Resolution Trace level quantification
Benefit Rapid diagnostics for contamination control
Automation Fully automated with fab communication support
Technology 3-beam system, automatic optics exchange
Compliance CE, NFPA, EU directives, GEM300, SEMI S2/S8
Throughput High-throughput mapping and monitoring
Core attributes Recipe-based operation, consistent repeatability
Core features Real-time diagnostics, high-sensitivity detection
Options E84/OHT support, advanced mapping tools
Measurement results Elemental maps, trace-level spectra

TXRF 310Fab-R Options

  • Extended mapping resolution
  • Custom holders for non-standard substrates
  • Enhanced reporting tools

The following accessories are available for this product:

TXRF 310Fab-R Events

Learn more about our products at these events

  • JSAP Autumn EXPO
    September 6 2025 - September 9 2025
    Nagoya, Japan
  • The 86th JSAP Autumn Meeting 2025
    September 6 2025 - September 9 2025
    Tokyo, Japan
  • SEMICON Taiwan
    September 9 2025 - September 11 2025
    Taipei, Taiwan
  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.