CT Lab HR160

High-resolution X-ray CT made simple 

160 kV. Submicron details. One simple CT system. 

The Rigaku CT Lab HR160 provides a simpler path to 160 kV submicron CT (computed tomography) for research, process development, and design engineering. Reveal internal structures with true 250 nm spatial resolution and a minimum voxel size of 62 nm—without complex workflows or hardware reconfiguration. 

CT Lab HR160

CT Lab HR160 Overview

Uncompromising high-resolution CT, now within reach for every lab

High-end CT scanners often include specialized measurement techniques and complex configurations that increase both cost and operational complexity. CT Lab HR160 focuses on the capabilities that matter most for practical research and engineering: 160 kV X-ray versatility, true 250 nm spatial resolution, a 62 nm minimum voxel size, and a straightforward workflow.

Its lens-free cone-beam geometry allows the field of view and resolution to be adjusted simply by changing the source-to-object distance and source-to-detector distance. No source, detector, or lens changes are required. This streamlined architecture makes it easier to move between samples and imaging requirements while minimizing setup time and hardware reconfiguration.

See both the big picture and the fine details

CT Lab HR160 combines a flexible field of view with true submicron imaging. The field of view ranges from 0.18 mm in diameter × 0.14 mm tall to 103 mm in diameter × 81 mm tall per scan. This flexibility allows users to inspect larger structures and then focus on small regions of interest for detailed analysis.

For example, an entire RAM stick can be scanned before zooming in to investigate micron-scale solder-joint defects, wire connections, buried circuits, connectors, and integrated-circuit layer integrity. Because the sample remains intact, internal structures can be studied without physical cross-sectioning.

One streamlined CT workflow

CT imaging requires scan-condition optimization, projection-image collection, reconstruction, and review of the resulting 3D volume. CT Lab HR160 simplifies this process with a one-flow-bar software interface that guides users through scan configuration and acquisition.

Reconstruction can be performed automatically, and reconstructed volumes can be loaded directly into CT Viewer for immediate review. The simplified workflow reduces trial and error, helps new users become productive more quickly, and lets experienced users move faster from sample setup to results.

Broad materials and application versatility

The combination of 40–160 kV operation, a 16.6 W nanofocus transmission X-ray source, flexible cone-beam geometry, and submicron imaging supports samples ranging from organic materials to electronic components.

Batteries

Visualize pores, cracks, and material inhomogeneity within and between battery electrode particles. Three-dimensional imaging can distinguish interparticle and intraparticle defects and help researchers investigate how manufacturing quality and cycling-induced degradation affect mechanical stability, capacity retention, reliability, and battery lifetime.

Electronics

Inspect printed circuit boards and small electronic components non-destructively. CT Lab HR160 can reveal solder-joint voids, broken or thinning connections, electrode layers, cracks, buried circuits, and dimensional variations while preserving the device for further testing.

Submicron imaging also supports detailed examination of multilayer ceramic capacitors and inductors, including electrode thickness and spacing, void distribution, thinning, and discontinuities that may affect electrical performance and reliability.

Advanced materials

Reveal voids, cracks, porosity, fiber orientation, delamination, adhesive bonds, weak interfaces, and other internal features in composites, resins, polymers, and molded materials. Non-destructive three-dimensional inspection helps connect processing conditions and microstructure with strength, reliability, damage, and long-term performance.

Additive manufacturing

Visualize and quantify cracks and pores in additively manufactured parts, including micropores within feedstock powders. The resulting data can help distinguish defects introduced during fabrication from those inherited from the feedstock and support process optimization, quality assurance, and failure analysis.

Medical devices and pharmaceuticals

Study the internal structure, function, and failure mechanisms of devices such as stents and implants without destroying the sample. Submicron X-ray CT can also reveal coatings, pores, internal defects, and other fine structures in pharmaceutical tablets and particles.

CT Lab HR160 Features

True 250 nm spatial resolution
Reveal fine internal structures in three dimensions with true 250 nm spatial resolution and a minimum voxel size of 62 nm. High-resolution performance is supported by a nanofocus X-ray source, high-resolution CMOS detector, source-to-detector distances of up to 800 mm, spot stability below 100 nm, and rotation-stage radial error below 100 nm.
160 kV X-ray versatility
An adjustable applied voltage range of 40–160 kV supports a broad variety of sample materials and imaging requirements. The 16.6 W nanofocus transmission source provides the penetration needed for demanding samples while retaining the imaging performance required for fine structural analysis.
Flexible field of view and resolution
Optimize the field of view and resolution by adjusting only the source-to-object distance and source-to-detector distance. The lens-free cone-beam geometry provides seamless imaging-geometry changes without exchanging sources, detectors, or lenses.
No hardware reconfiguration
A single nanofocus X-ray source, single CMOS detector, and simple lens-free architecture eliminate the complexity associated with multi-source, multi-detector, and multi-lens systems. Users can accommodate different sample sizes and resolution requirements without frequent hardware changes or complex alignment procedures.
Simple one-flow-bar software
Move through sample setup, scan acquisition, reconstruction, and visualization in one streamlined workflow. The software guides scan configuration and operation, supports automatic reconstruction, and loads completed volumes directly into CT Viewer for review.
Multiple scan modes
Standard, stitched, and half-scan modes provide additional flexibility for different sample dimensions and imaging requirements.
Large sample capacity
The system accommodates objects weighing up to 10 kg. Maximum sample dimensions are 250 mm in diameter × 450 mm high with the XYZ stages at their zero positions, or 200 mm in diameter × 200 mm high with full XYZ travel.
Practical high-resolution CT
CT Lab HR160 concentrates investment on the core technologies needed for 160 kV, true submicron CT rather than specialized configurations that may not be required for routine research, process-development, and design-engineering work.
Training and lifetime application support
In-person training helps users become comfortable collecting and analyzing data from their own samples. Rigaku application experts continue to provide technical support in establishing inspection and analysis procedures throughout the lifetime of the CT Lab HR160

CT Lab HR160 Specifications

Minimum voxel size 62 nm
Maximum field of view (FOV) 103 mm diameter × 81 mm tall per scan
Source-to-object distance (SOD) 1.0 – 584 mm
Source-to-detector distance(SDD) 200 – 800 mm
Maximum sample/object size φ250 mm × H450 mm (XYZ = 0; no travel)
φ200 mm × H200 mm (full XYZ travel)
Sample rotation -180 - 540º
Best spatial resolution 250 nm @ 300 nm focus size
Maximum sample/object weight 10 kg
Scan modes Standard, stitched, half
Geometry Lens-free cone-beam geometry
X-ray source Maximum 16.6 W
X-ray energy W anode, adjustable applied voltage 40-160 kV
Detector High-resolution CMOS
Detector pixel size 49.5 × 49.5 μm
Detector size 2352 × 2944 pixels
Detector active area 116.4 mm × 145.7 mm
Dimensions 2040 (W) x 990 (D) x 1825 (H) mm
Weight 1850 kg (including the CT system, X-ray generator unit, and radiation shield)

CT Lab HR160 Resources

CT Lab HR160 Events

Learn more about our products at these events

  • ToScA
    September 2 2026 - September 4 2026
    Thessaloniki, Greece
  • [MEET THE EXPERT] Implants 2026
    September 15 2026 - September 15 2026
    Solothurn, Switzerland
  • GeoDict Innovation Conference 2026
    September 29 2026 - September 30 2026
    Frankfurt, Germany
  • MS&T 2026
    October 4 2026 - October 7 2026
    Pittsburgh, PA, USA
  • Battery Show 2026
    October 12 2026 - October 15 2026
    Detroit, MI, USA
  • Gulf Coast Conference (GCC) 2026
    October 13 2026 - October 15 2026
    Galveston, TX, USA
  • AAPS PharmSci 360 - 2026
    October 25 2026 - October 28 2026
    New Orleans, LA, USA
  • MATERIAUX 2026
    November 16 2026 - November 20 2026
    Grenoble, France
  • Advanced Automotive Battery Conf 2026
    December 8 2026 - December 11 2026
    Las Vegas, NV, USA

Contact Us

Whether you're interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.