From Si on plastic to semiconductor wafer stacks
Every aspect of modern life benefits from coating or thin film technology. Whether a barrier layer film in an integrated circuit chip or a conversion coating on an aluminum beverage can, X-ray analytical techniques are integral to both R&D development, production process control and quality assurance. X-ray fluorescence (XRF) can determine the thickness and elemental composition of metallic coatings. Commonly employed in the semiconductor manufacturing process as a metrology tool, X-ray reflectometry (XRR) is used to measure layer thicknesses in a multi-layer stack of coatings and also can characterize other coating properties like roughness and interlayer diffusion. Emerging as a leading enabler for nano-technology research, X-ray diffraction (XRD) and associated techniques are employed to examine the nature of the molecular structure of films. Rigaku technology and experience provide a variety of non-destructive analytical solutions for coating and thin film measurements.
Application Notes
The following application notes are relevant to this industryXRD
EDXRF
Process
Total reflection XRF (TXRF)
Rigaku recommends the following systems:
WDXRF
Benchtop tube below sequential WDXRF spectrometer analyzes O through U in solids, liquids and powders
High power, tube above, sequential WDXRF spectrometer with new ZSX Guidance expert system software
High-power, tube-below, sequential WDXRF spectrometer with new ZSX Guidance expert system software
XRD
New 6th-generation general purpose benchtop XRD system for phase i.d and phase quantification
Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software
EDXRF
Low-cost EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin-films
Performance EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin-films
High-performance, Cartesian-geometry EDXRF elemental analyzer measures Na to U in solids, liquids, powders and thin films
