Various materials are used in the process of polishing glass to remove fine scratches on glass surface or improve smoothness. Hematite particles (α-Fe₂O₃) were used formerly and recently using Bastnasite particles (CeO₂ basis) has become mainstream. The new materials are also being studied instead of expensive R.E. Bastnasite abrasive is known to be effective for polishing by chemical reaction between its main component CeO₂ and glass. At the same time, however, it tends to remain on the sample surface after polishing. On a measurement result of a commercially available glass substrate, Ce and Ba, which are abrasive components, were detected on the surface, suggesting that the abrasives are remained. It can be removed by re-polishing with alumina abrasive.
The new, next generation benchtop total reflection X-ray fluorescence (TXRF) spectrometer
Trace elemental surface contamination metrology by TXRF; up to 200 mm wafers.
Trace elemental surface contamination metrology by TXRF; up to 300 mm wafers
Ultra-trace elemental surface contamination metrology by TXRF with VPD capability; up to 300 mm wafers