Rigaku Introduces Two Innovations in Semiconductor Metrology at ICSCRM 2025

Rigaku Corporation, a global leader in X-ray analytical instrumentation, will present two breakthrough platforms at the International Conference on Silicon Carbide and Related Materials (ICSCRM) in Busan, Korea. The XTRAIA™ XT Series and XTRAIA™ TF Series expand Rigaku’s semiconductor metrology portfolio, advancing its Lab-to-Fab strategy for compound semiconductors. 

XTRAIA XT Series  – Next-Generation X-ray Topography 

 The XTRAIA XT is Rigaku’s latest X-ray topography system, purpose-built for quality control in silicon carbide (SiC) wafer and device manufacturing. The platform provides fast, non-destructive detection of basal plane dislocations (BPD) and threading screw dislocations (TSD), enabling fabs to reduce yield loss and improve device reliability. 

• Comprehensive wafer mapping of BPD and TSD. 
• Compatible with automation in cleanrooms (equivalent to ISO Class 6) 
• SEMI S2/S8 and GEM300 compliance for fab-ready automation. 

XTRAIA XT-3000 is optimized for up to 300 mm wafers. 

 XTRAIA TF Series – Fab-Ready Thin Film Metrology 

The XTRAIA TF Series sets a new benchmark for thin film characterization with non-destructive, full-wafer XRD mapping of thickness, crystallinity, strain, and relaxation. Supporting both 200 mm and 300 mm wafers, it integrates seamlessly into production while retaining research-level flexibility. 

• Full-wafer uniformity maps for epitaxial and multi-stack films. 
• Crystal strain monitoring to prevent process drift. 
• High-speed scans with HyPix 2D detectors. 
• Compatible with automation in cleanrooms (equivalent to ISO Class 6) 
• SEMI S2/S8 and GEM300 compliance for fab-ready automation. 

Available models include the XTRAIA TF-2000 (200 mm) and XTRAIA TF-3000 (300 mm). 

Rigaku at ICSCRM 2025 

Rigaku will showcase its end-to-end metrology portfolio at Booths 213 & 224, covering every stage of compound semiconductor manufacturing: 

• Substrate process: FSAS III, XTRAIA XT Series, TXRF 3760, TXRF 310Fab. 
• Epitaxial process: SmartLab, XTRAIA TF Series. 
• Device process: ONYX 3000, WDA-3650, WaferX 310, XHEMIS EX-2000. 

With the lineups, Rigaku reinforces its role as a trusted partner in enabling SiC and compound semiconductor manufacturers to scale production, control variability, and bring next-generation devices to market with confidence.