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Rigaku at ECTC 2026

Advanced semiconductor packaging and heterogeneous integration demand deep materials insight, precise metrology, and reliable defect control. Rigaku delivers industry-leading X-ray characterization and inspection solutions supporting process development and manufacturing across advanced packaging and compound semiconductor technologies.

Meet Rigaku at ECTC 2026 at Booth 141. Discover advanced X-ray metrology for packaging, heterogeneous integration, and wide bandgap devices.

At the IEEE Electronic Components & Technology Conference (ECTC) 2026, Rigaku showcases advanced X-ray metrology solutions designed to address the complex materials challenges of next-generation semiconductor technologies. From advanced packaging and heterogeneous integration to wide bandgap devices, Rigaku enables precise, non-destructive characterization of thin films, interfaces, crystal structures, and nanoscale features. Our portfolio of X-ray techniques, including XRR, HRXRD, TXRF, CD-SAXS, and X-ray topography, provides the critical materials insight needed to optimize processes, improve yield, and accelerate development across both R&D and high-volume manufacturing environments. Visit Rigaku at Booth 141 to explore how advanced X-ray metrology supports innovation from wafer materials to integrated semiconductor systems.

Meet Rigaku at ECTC
Explore Packaging Metrology Solutions
Download the Applications Guide
  Advanced packaging Heterogeneous integration Power & wide bandgap devices
Semiconductor segment Next-generation packaging architectures require precise control of metal thickness, interconnect layers, and bonding interfaces. Rigaku X-ray metrology enables accurate characterization of multilayer stacks critical to performance and yield. Chiplet architectures and 2.5D/3D integration introduce complex multimaterial interfaces and advanced device stacking. Rigaku technologies provide nanoscale insight into these integrated systems. Wide bandgap materials enable high-performance power electronics but require strict defect control and crystal quality monitoring to ensure reliability.
Application
  • Redistribution Layers (RDL)
  • BEOL stacks
  • Hybrid bonding layers
  • Interposers and substrates
  • Chiplet integration
  • Multimaterial interfaces
  • 2.5D / 3D integration structures
  • Silicon Carbide (SiC)
  • Gallium Nitride (GaN)
  • Gallium Arsenide (GaAs)
  • Indium Phosphide (InP)
Rigaku capabilities
  • Metal thickness and composition measurement
  • Interface roughness and density characterization
  • Strain and epitaxial structure analysis
  • Structural inspection of stacked devices
  • Critical dimension and profile metrology
  • Interface roughness and density analysis
  • Hybrid X-ray + optical metrology for multilayer stacks
  • X-ray topography for defect imaging
  • High-resolution XRD for epitaxy and strain analysis
  • Thin film characterization for thickness, density, and stress

Explore packaging metrology solutions

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