Ultima IV

$Ultima IV automated multipurpose X-ray diffractometer (XRD)$ $Ultima IV automated multipurpose X-ray diffractometer (XRD)$ $Ultima IV automated multipurpose X-ray diffractometer (XRD)$

Features

Fully automated optical alignment under computer control.
Optional in-plane diffraction arm for in-plane measurements without reconfiguration.
Focusing and parallel beam geometries without reconfiguration with CBO optics.
Small angle X-ray scattering (SAXS) capabilities.
Various automated non-ambient stages are available.

Automated multipurpose X-ray diffractometer (XRD)

Powder diffraction, thin film diffraction, SAXS, pole figure, residual stress and in-plane experiments

Learn More

The Ultima IV represents the state-of-the-art in multipurpose X-ray diffraction (XRD) systems. Incorporating Rigaku's patented cross beam optics (CBO) technology for permanently mounted, permanently aligned and user-selectable parallel and focusing geometries, the Ultima IV X-ray diffractometer can perform many different measurements...fast.

Engineered for Performance

With a multipurpose diffractometer, performance is measured by not only how fast you perform an experiment but also how fast you can switch between different types of experiments. Individual experiments are optimized with accessories like the D/teX Ultra high-speed position sensitive detector system, but the speed between experiments is radically improved with the combination of the automated alignment and CBO.

Designed for Flexibility

The Ultima IV is the only XRD system on the market today that incorporates fully automatic alignment. When coupled with CBO and the in-plane arm, the automatic alignment capability makes the Ultima IV X-ray diffractometer the most flexible system available for multipurpose applications.

Functionality Redefined

In the Ultima IV XRD system, CBO technology eliminates time spent switching geometries, enables everyday users to run both sets of experiments without the need to reconfigure the system, and reduces wear and possible optic damage associated with the recurrent switching process. CBO and automatic alignment combine for the ultimate in functionality for: micro-crystalline diffraction, thin-film diffraction, small angle scattering, and in-plane scattering.

Specifications

Product name	Ultima IV
Technique	X-ray diffraction
Benefit	Powder diffraction, thin film diffraction, SAXS, pole figure, in-plane and non-ambient experiments
Technology	Multipurpose θ-θ X-ray diffractometer
Core attributes	3 kW sealed X-ray tube, D/teX Ultra silicon strip detector, independent θ-θ geometry
Core options	Many attachments, 10-position sample changer and other sample holders
Computer	External PC, MS Windows^® OS, SmartLab Studio-II software
Core dimensions	1100 (W) x 1600 (H) x 80 (D) mm
Mass	Approx. 700 kg (core unit)
Power requirements	3Ø, 200 VAC 50/60 Hz 30 A or 1Ø, 220-230 VAC 50/60 Hz 40 A,

Options and Accessories

The following accessories are available for this product

Anton Paar TTK 600 Low Temperature Chamber

The TTK 600 Low-Temperature Chamber is a non-ambient attachment for powder X-ray diffraction studies from -190°C to 600°C. Different sample holders allow investigating samples in reflection and transmission geometry. Samples can be measured in vacuum, air or inert gases. An antechamber option allows safe transfer of air-sensitive samples into the TTK 600.

The TTK 600 fits to all common powder diffractometers and is the instrument of choice for X-ray structure analysis of various sample types at low and medium temperatures.

Non-ambient attachment for X-ray diffraction studies from -190 °C to 600 °C
For investigations on samples in reflection and transmission geometry
Also for air-sensitive samples and in-operando studies on batteries
Fits to all common powder diffractometers

Anton Paar HTK 2000N High-Temperature Chamber

High-temperature sample heating stage with strip heater for powder XRD of refractory materials. The use of a tungsten strip offers extremely high temperature and fast heating and cooling, the strip pre-stressing mechanism ensures high sample position stability.

Temperature range:

with W-strip: 25 °C to 2300 °C in vacuum
with Pt -strip: 25 °C to 1600 °C in air, vacuum

Atmospheres: vacuum(10⁻⁴ mbar), inert gas, air

Anton Paar HTK 16N High-Temperature Chamber

High-temperature sample heating stage with strip heater for powder diffraction. Allows for very fast heating and cooling and ensures high sample position stability with heating strip pre-stressing.

Temperature range:

with Pt-strip: 25 °C to 1600 °C in air, vacuum
with Ta and C-strip: 25 °C to 1500 °C in vacuum

Atmospheres: air, inert gas, vacuum(10⁻⁴ mbar)

Anton Paar HTK 1200N High-Temperature Oven Chamber

High-temperature heating stage for powders and polycrystalline solid samples. Heating to 1200 °C in air and vacuum possible.

Main features:

furnace heater for good temperature uniformity
sample spinning for good data quality
capillary option for transmission XRD
easy sample loading

Temperature range: 25 °C to 1200 °C

Atmospheres: air, inert gas, vacuum(10⁻⁴ mbar)

HT 1500 high temperature attachment

Automated variable temperature stage for in-situ X-ray diffraction measurements of materials at ambient and elevated temperatures (up to 1500°C). The stage may be operated in air, gas, vacuum, or under inert gas such as helium or nitrogen. The sample is heated radiantly for reduced heat gradients within the sample. Automated z translation within the stage assures precise sample positioning even in the presence of thermal expansion of the sample.

Reactor X high temperature attachment for reactive gases

Reactor X allows measurements to be performed under high temperature (RT - 1000°C) in vacuum, inert gas, reactive gas, or mixture of these. Infrared heating enables rapid heating and cooling of the sample and use of wide variety of sample holders so that a suitable sample holder material can be selected according to the combination of the sample, gas, and applied temperature.

Advanced thin film attachment

Multipurpose attachment for the precise alignment of thin film samples. Fully automated alignment provides extreme ease in the positioning of samples for X-ray reflectivity, in-plane diffraction, and orientation analysis. Utilizes the Rx/Ry design for the most flexible reciprocal space scanning options.