Small-angle X-ray scattering shape metrology for 3D semiconductor devices
Takumi Goto
The etching technique for high-aspect-ratio hole structures is one of the key technologies in modern semiconductor device manufacturing. Accurately evaluating hole shapes is crucial for developing and controlling the etching process. In order to create a precise evaluation system for deep hole shapes, Rigaku has developed a transmission small-angle X-ray scattering (T-SAXS) instrument. In this technical note, we describe the principles of a small-angle X-ray scattering (SAXS) technique for the determination of three-dimensional semiconductor device structures and its measurement sensitivity based on simulation results. We also demonstrate its performance for SAXS metrology by the measurement of deep holes on a 300 mm wafer. As a result of these measurements we were able to obtain the distribution of deep hole sizes and their tilt across the entire wafer.
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Validity evaluation of SQX analysis results
Yasujiro Yamada
Standardless FP analysis can easily calculate analytical values, but there is no established method for assessing them. Consequently, their reliability may decrease if appropriate sample models and corrections are not set. One approach to address this issue is by comparing the Compton scattering X-ray intensity, converted from the theoretical Compton scattering X-ray intensity (calculated from the analytical value), to the measurement intensity scale (hereinafter, “theoretical scattering intensity”) with the actual measured Compton scattering X-ray intensity (hereinafter, “measured scattering intensity”). In this paper, we introduce the method and show the effectiveness for the validity evaluation of SQX analyses.
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Compton scattering internal standard correction extended by FP method and applied to metal element analysis of ore and concentrate samples
Hisashi Homma
The Compton scattering internal standard correction technique, which is a matrix correction method conventionally used for geological powder sample analysis, has been improved by integration of a matrix correction term. The matrix correction coefficients are theoretically calculated by the fundamental parameter (FP) method. The improved method accurately extends the applicable range of calibrations to high concentrations.
The improved correction method can be applied to mining samples, such as iron ores, copper ore / concentrate and nickel oxide and sulfide ores analyzed by the pressed pellet method.
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Applications of TG-FTIR: From Polymers to Pharmaceuticals, Foods, and Inorganic Materials
Yoshinobu Hosoi
TG-FTIR, which combines Simultaneous Thermal Analysis (STA) consisting of Thermogravimetry (TG) and Differential Thermal Analysis (DTA) with Fourier Transform Infrared Spectroscopy (FTIR), is an effective method for simultaneously obtaining information about the reactions occurring in a sample upon heating and the resulting reaction products. This paper presents several applications of TG-FTIR in the analysis of polymers, pharmaceuticals, foods, and inorganic materials. In fiber-reinforced plastics (FRPs), bisphenol A is evolved under thermal decomposition, while CO₂ is released during combustion. For other polymers, H₂O and CO₂ were quantified during combustion. TG-FTIR was also applied to simulate the ceramic debinding process and identify polymer plasticizers. Additionally, TG-FTIR proved effective in analyzing dehydration in pharmaceuticals, thermal oxidation of edible oils, and reactions in inorganic materials such as gypsum dihydrate.
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X-ray Seamless Pixel Array Detector High energy resolution detector
for a benchtop X-ray diffractometer
In X-ray diffraction measurements using a Cu source, transition metals in the sample—for example, batteries and steel materials—generate fluorescent X-rays. These fluorescent X-rays raise background intensities in the measured data, making it difficult to detect peaks derived from trace crystalline phases. The new “XSPA-200 ER” detector, which can be mounted on a benchtop X-ray diffractometer, has high energy resolution, enabling measurements with low background intensities.
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High-voltage micro-CT system
Ted Huang, Angela Criswell
The CT Lab HV, developed by Rigaku, features a 225 kV X-ray source, a high-precision rotation stage, and a large detection area, enabling a broad variety of high-resolution imaging applications. Application examples, including additively manufactured superalloys and lithium-ion battery protection boards, highlight its effectiveness in defect detection, structural analysis, and product simulation. As demand for advanced imaging grows, the CT Lab HV offers an innovative solution for industry and research, enhancing the adoption of X-ray CT in critical applications.
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