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Semiconductors

Semiconductors

Film thickness/composition and wafer contamination tools

Rigaku is a pioneer and world leader in designing and manufacturing X-ray technology based instrumentation to solve manufacturing challenges in semiconductor R&D and production. With more than 35 years of global market leadership in this industry, our families of products enable everything from in-fab process control metrology to R&D for thin film and materials characterization. Our X-ray Diffraction (XRD), X-ray Fluorescence (XRF), X-ray Reflectometry (XRR) and X-ray topography (XRT) metrology tools measure critical process parameters like thin film: thickness, composition, roughness, density, porosity, and crystal structure and crystal structure defects. In addition, we offer process Total Reflection X-ray Fluorescence (TXRF) and Vapor Phase Decomposition-Total Reflection X-ray Fluorescence (VPD-TXRF) tools for contamination measurement. With global 24/7 service and support, Rigaku delivers cutting-edge solutions for your yield enhancement and process development.

Rigaku recommends the following systems:


XRD

Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software

X-ray CT

High-speed, stationary sample microtomography of large samples

High-resolution benchtop microtomography of large samples

X-ray topography (XRT)

A fast, high-resolution laboratory X-ray topography system for non-destructive dislocation imaging

Semiconductors

In-line, simultaneous WDXRF spectrometer for wafer metal film metrology; up to 300 mm wafers

Simultaneous WDXRF spectrometer for wafer metal film metrology; up to 200 mm wafers

Sequential WDXRF spectrometer for elemental analysis and thin-film metrology of large and/or heavy samples

Process XRR, XRF, and XRD metrology tool for blanket and patterned wafers; up to 300 mm wafers

Trace elemental surface contamination metrology by TXRF; up to 200 mm wafers.

Trace elemental surface contamination metrology by TXRF; up to 200 mm wafers.

Trace elemental surface contamination metrology by TXRF; up to 300 mm wafers

Ultra-trace elemental surface contamination metrology by TXRF with VPD capability; up to 300 mm wafers

XRF and optical metrology tool for blanket and patterned wafers; up to 300 mm wafers